6xΦ6mm sintered copper heatpipes with matrix
layout transfer the heat to fins efficiently.
Sintered Copper Heatpipe
with Mirror Polish Finish
45*39.5mm mirror copper base, with soldering and
precision milling, transfers the heat from CPU to
heatpipes more evenly.
50pcs fins for each tower, bigger thermal surface area
Zipper fin tech guarantees even space between fins
Dual 12cm Fans with static RGB
Zipper fin technology tighten the fin pack which is stacked by high density fins.
Multiply Platforms Compatibility
Compatible with Intel/AMD mainstream platforms.
Max. RAM height with cover: 39mm. No risk of keep-out.